Small size conserves PCB space in assemblies providing lots of flexibility in design options.
High ampacity to size ratio
Designed to deliver high current capacity for high-density power applications
Accommodates large mating mismatch or offsets
Floating Contact Technology allows for busbar misalignment helps take up stack-up tolerance in subassemblies.
Connection Technologies Develops power subassemblies that can be plugged together easily on the assembly floor.
Allows for busbar misalignment helps take up stack-up tolerance in subassemblies.
Small size takes up very little space in assemblies providing lots of design options that translate to robust manufacturing methods.
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Samples will be given out to only qualified* applications.